Our facility manufactures single-side, double-side, and multilayer bare boards with tight process controls at every stage — imaging, etching, plating, and finishing — supporting both quick-turn prototypes and scaled production runs.
Standard and quick-turn availability.
Up to [X] layers, controlled impedance available.
FR-4, high-Tg, and flex substrates.
HASL, ENIG, and OSP.
[X] mil, tightened for advanced designs.
Fast-tracked runs for early-stage validation.